|
層數 |
Layers |
1-36(層)Layers |
|
最大加工面積 |
Max.Board Size |
23inch * 48inch |
|
板厚 |
Board Thickness |
0.2-5.0mm |
|
最小線寬 |
Min.Line Width |
0.15mm |
|
最小間距 |
Min.Space |
0.15mm |
|
最小孔徑 |
Min.Hole Size |
0.15mm |
|
孔壁銅厚 |
PTH Wall Thickness |
>0.025mm |
|
金屬化孔徑公差 |
PTH Hole Dia.Tolerance |
±0.05mm |
|
非金屬化孔徑公差 |
Non PTH Hole Dia.Tolerance |
±0.05mm |
|
孔位公差 |
Hole Position Deviation |
±0.076mm |
|
外形尺寸公差 |
Outline Tolerance |
±0.1mm |
|
開槽 |
V-cut |
30°/45°/60° |
|
阻焊層最小橋寬 |
Soldemask Layer Min.Bridge width |
5mil |
|
阻焊膜最小厚寬 |
Soldemask film Min.Thickness |
10mil |
|
絕緣電阻 |
Insulation Resistance |
1012Ω(常態)Normal |
|
抗剝強度 |
Peel-off Strength |
1.4N/mm |
|
阻焊劑硬度 |
Soldemask Abrasion |
>5H |
|
熱衡擊測試 |
Soldexability Test |
260℃20(秒)second |
|
通斷測試電壓 |
E-test Voltage |
50-250V |
|
介質常數 |
Permitivity |
ε=2.1~10.0 |